Page 9 - Electric&Electronics - Total Solution for Analyzing Electronic Devices

Observation and Analysis/Evaluation

Non-Destructive Observation of Interior Objects

● Observation of Internal Structures in Electrical/Electronic Components and Failure Analysis ● Inspection of Solder Joints on Mounted Circuit Boards (BGA Joints, etc.)

Microfocus X-Ray CT System Microfocus X-Ray Inspection System
inspeXio SMX-225CT HR Plus Xslicer SMX-1010 / 1020

・With an exterior camera for CT scan positioning, functionality for automatically ・In addition to easier operation, the stage movement and detector acquisition speeds
setting X-ray parameters based on the given sample, and other features, were increased to signi cantly shorten inspection times. Consequently, inspection
high-de nition three-dimensional CT images can be obtained using simple operations operations can be accomplished more ef ciently. Xslicer SMX-1010/1020 systems can
without any need for tedious steps. be used to inspect a wide range of electrical and electronic components, from surface
・Due to the powerful X-ray generator, with a 4 µm focus size and 225 kV tube voltage, mounted circuit boards to various sensors and cable harnesses.
the system can be used to inspect a wide range of items. ・CT functionality is available as an option.
・A dedicated NDI X-ray pay-as-you-go X-ray generator maintenance service is available
for paying only for the X-ray emission time actually used.
Crystal Oscillator Cross-sectional image (1) Cross-sectional image (2)

BGA
Crystal fragment

Cross-sectional image (3) Cross-sectional image (4)
IC for oscillation circuit
Bonding wire
Short Open Void
The presence of voids (bubbles) in the conductive adhesive can be determined from the Surface
cross-sectional image (3). The bonding wire connection status to the oscillation IC can be
determined from the cross-sectional image (4). The status of solder joints and the shape of Mounted
bonding wires can be con rmed by magnifying images and displaying them three-dimensionally. Devices
Conductive adhesive Void Bonding wire connection area

Microfocus X-Ray CT System Solder Wicking Terminals QFP Solder Wetting
inspeXio SMX-100CT Plus

・Achieves low noise and high de nition
New image processing technology achieves both low noise and high de nition.
That means more vivid images can be obtained.
・CT scan area display function
The CT scan area display function shows a real-time image of the CT scan region in Microfocus X-Ray Inspection System
overview image data of the sample, ensuring that CT scans for the position of interest
can be obtained. Xslicer SMX-6010

This X-ray inspection system is equipped with a Shimadzu microfocus X-ray generator
and high-resolution at panel detector and features tilted CT scanning capability. By
Chip Inductor seamlessly switching between X-ray uoroscopy and CT observation modes, the system is
(1005 size)
well-suited for inspecting complex surface-mounted circuit boards.

This is an example of observing BGA connections on a circuit board
installed in a smartphone. It shows that internal structures can be
accurately understood using CT in combination with X-ray
uoroscopy, even for double-sided surface-mounted circuit boards
that are dif cult to observe adequately with X-ray uoroscopy alone.
In addition, optional software allows for quantitatively evaluating the
volume of voids inside BGA connections.

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