Page 11 - Shimadzu DTG-60 Series

Optional Software

A variety of optional software is available for LabSolutions TA, providing excellent operability and functionality, and further expanding
the range of applications.

SBR Specific Heat Measurements
Temperature-Modulated DSC Program DSC PET Glass Transition Measurements Specific Heat Analysis Program DSC DTG DTA
Using temperature-modulated DSC measurements, you can separate complex data such as To measure the specific heat of samples using DSC, a comparison of the calorific values of three
overlapping transitions and reactions, and can measure specific heat. For specific heat measurement results (a blank, a standard, and the sample) is calculated.
measurements, the number of measurement cycles is fewer than with standard DSC With this program, the above-mentioned calculations are automated, so finding the specific heat
measurements, the process is easier, and pseudo isothermal measurements, which were is easy. In addition to determining the desired specific heat at each temperature, the program can
impossible with standard DSC, can now be performed. also calculate the specific heat simultaneously at preset temperatures (up to 15 temperatures).
Temperature-modulated DSC measurements achieve both high resolution and high sensitivity,
which have been difficult to achieve with standard DSC measurements, enabling higher accuracy
measurements.

Stress-Strain Analysis Program TMA Young's Modulus for Magnetic Tape
Partial Area Analysis Program DSC DTG TMA TGA DTA Fusion of Chocolate
The stress versus strain curve for materials can be obtained by plotting the data measured
This software can calculate partial fusion rates at various temperatures, and find the temperature at with TMA (time/temperature, displacement and load) with strain on the horizontal axis and
which the specified partial fusion rate is shown, for use as a quality control index. stress on the vertical axis, thereby learning the temperature change in Young's modulus and
averaged Young's modulus for films and fibers.
In addition, up to 12 analyzed stress-strain curve data sets can be overlapped.

Reaction Rate Analysis (TG) Program DTG TGA Analysis of the Reaction Rate of Nicotinamide
Purity of Benzoic Acid
Purity Analysis Program DSC DTG DTA This software analyzes the data from the decomposition reaction of a sample, obtained from
thermogravimetry, using the Ozawa method. It then obtains the activation energy, the frequency
In measurements of purity using DSC, pretreatment of samples is not required, even for trace factor and other reaction rate parameters. It is applied to estimations of reaction mechanisms,
samples, and the purity is obtained quickly and with easy operations. It is widely used for evaluation of the thermostability of materials, and estimations of material operating life.
analysis of pharmaceuticals, industrial chemicals, and reagents. It can be used for a wide range of samples, including high molecular weight materials, electrical
With calculations by this program, the purity can be calculated accurately, even for materials insulation materials, thermally stable polymers, composite materials, and pharmaceuticals.
that degrade during fusion.

Reaction Rate Analysis of an Epoxy Resin
Dynamic Temperature Control Program DTG TMA Dehydration of Copper Sulfate Reaction Rate Analysis (DSC) Program DSC DTG DTA
(Dynamic/Temperature Increases at a Constant Rate)
Controls the temperature that switches between high and low rise speeds in a temperature This software is applied to the analysis of reaction rates for chemical reactions (such as the
program, corresponding to the rate of change of the TG weight signal and the TMA curing of epoxy resins) without changes in weight. As when using TG, the analysis is performed
displacement signal. via the Ozawa method. Using the DSC data measured by changing the heating rate, an Ozawa
In comparison to measurements in which the temperature rises at a constant rate, the plot is charted, and the activation energy, frequency factor, and other reaction rate parameters
software is useful for improving the resolution with multi stage changes in TG, and for are obtained. As an example, the figure shows a reaction rate analysis of the curing reaction for
sintering conditions for ceramic materials in TMA. an epoxy resin.
The relationship between the curing temperature, curing time, and degree of curing can be
simulated based on the parameters obtained.

Note: Analysis can also be performed for the DTA signal, but the photometric accuracy is not guaranteed.

60 Series
10 Thermal Analysis Instruments 11