Page 16 - Shimadzu inspeXioSMX-225CT FPD HRPlus
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Applications see enlarged application data.
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BGA (Ball Grid Array)
MPR Image FOV = ø5 mm VR Image
Crystal Unit
CR Image FOV = 10 mm × 20 mm VR Image Defect Analysis
Wireless Earphones
Oblique Image FOV = ø30 mm Oblique Image FOV = ø30 mm VR Image
Concrete
MPR Image FOV = ø42 mm VR Image Void Analysis
Provided by Emeritus Professor Moriyoshi at Hokkaido University
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