Page 10 - Shimadzu Xslicer SMX-6010

Versatile, User-Friendly Functions

Ball Grid Array (BGA) Measurements Wire Sweep Ratio

Measurements Wire
BGA bump diameters and void ratios can be measured. L2
With our proprietary image processing algorithm, complicated parameter settings are
unnecessary.* The wire sweep ratio can be measured by specifying both ends L1
Multiple settings can be saved and applicable ones can be accessed for each inspection target of the bonding wire and the point of maximum curvature. Wire Sweep Ratio =
prior to measurement. Pass/fail determinations can be made depending on the wire L2/L1 × 100 (%)
* Manual adjustments may be required depending on the sample. sweep ratio.

(Measurable Items)
• Total void ratio
• Maximum void ratio
• Bump diameter
• Bump roundness

Area Ratio Measurements
Dimension Measurements
Die bonds, solder paste wettability, and other area ratios can be measured. ROI
The parameter settings are not required thanks to Shimadzu's proprietary image processing The Xslicer SMX-6010 supports both 2-point distance and 3-point measurements.
algorithm.* With this system, sizes are measured efficiently by calculating calibration data internally in
It is also possible to save multiple settings, and then call up the applicable settings for each synchronization with the fluoroscopic magnification.
inspection target prior to measurement. Furthermore, pass/fail determinations can be made
based on the area ratio.
* Manual adjustments may be required depending on the sample.
* The measurement range (ROI) can be configured manually. Static Image

Xslicer SMX-6010
10 Microfocus X-Ray Inspection System 11