Page 10 - Shimadzu Xslicer SMX-1010

Image Measurement Functions

Ball Grid Array (BGA) Measurements Wire Sweep Ratio Measurements Point of Maximum Curvature

Wire
BGA bump diameters and void ratios can be measured. The wire sweep ratio can be measured by specifying both ends L2
With our proprietary image processing algorithm, complicated parameter settings are of the bonding wire and the point of maximum curvature. L1
unnecessary.* Pass/fail determinations can be made depending on the wire
Multiple settings can be saved and applicable ones can be accessed for each inspection target sweep ratio. Wire Sweep Ratio =
prior to measurement. L2/L1 × 100 (%)
* Manual adjustments may be required depending on the sample.

(Measurable Items)
• Total void ratio
• Maximum void ratio
• Bump diameter
• Bump roundness

Area Ratio Measurements
Dimension Measurements
Die bonds, solder paste wettability, and other area ratios can be measured.
The parameter settings are not required thanks to Shimadzu's proprietary image processing
algorithm.* The Xslicer SMX-1010/1020 supports both 2-point distance and 3-point measurements.
It is also possible to save multiple settings, and then call up the applicable settings for each With this system, sizes are measured efficiently by calculating calibration data internally in
inspection target prior to measurement. Furthermore, pass/fail determinations can be made synchronization with the fluoroscopic magnification.
based on the area ratio.
* Manual adjustments may be required depending on the sample.
* The measurement range (ROI) can be configured manually.

ROI

Static Image

Xslicer SMX-1010/1020
10 Microfocus X-Ray Inspection System 11