Page 14 - Shimadzu Xslicer SMX-1010

Applications

BGA Mounting board IC chip copper wire USB

VR image VR image VR image Dimension measurement
Short Open Void
Resin connector GFRP QFP 21700 lithium ion battery
Mounting parts

Void analysis VR image VR image VR image

Solder wicking Terminal QFP solder wettability
Available Options

Wireless earphone
Hardware Options

Rotation/Inclination Unit Main Specifications
Adding the detachable rotation/ 1. Weight of
inclination unit enables X-ray Mounting Grip : 20 g max.
fluoroscopy of small parts from a
number of directions, reducing 2. Rotation : Continuous rotation
Whole perspective image Lithium ion battery Speaker coil omissions in inspections. 3. Tilt : ±30°

Aluminum die-cast LED Crystal oscillator VCT Unit Main Specifications
See page 7 1. Size : 50 mm × 100 mm circuit boards
(with a thickness of 1 mm to 2 mm) max.
Small Samples: φ30 mm × 25 mm max.
2. Weight : 100 g max.

Optional Software

FET aluminum wire Damaged power IC Wire bonding VGSTUDIO
Three-Dimensional Image Processing Software
This sof tware uses volume rendering ( VR) to display
three-dimensional images from cross-sectional images
obtained using X-ray CT imaging. It includes functionality
for creating basic animation and simple measurements.

Xslicer SMX-1010/1020
14 Microfocus X-Ray Inspection System 15