Page 19 - EDX-7200

ʔThickness and Composition Measurement of Electroless Ni-P Plating Filmsʔ
The thin-film FP method can be used to measure the thickness of multilayer films or simultaneously quantify the thickness and composition of films.
The following shows an example of quantifying the 4.8 m thickness of a plating film and the concentration of its principal components Ni and P.
Trace quantities of Pb were also detected.

Cu substrate

Ni, P, Pb
Primary Fluorescent
X-rays X-rays

Image of Sample Left: Base copper Right: Plating

Ni, P, and Pb Peak Profiles
Quantitative Analysis Results Using the
Thin-Film FP Method
The thin-film FP method requires specifying the base material of the substrate
and other layers, and the layer sequence and element information for the film.

Plating, Thin FilmsɹʔThickness Measurement of Plating on Irregular Shaped Sampleʔ
EDX performs measurement of plating thickness without any standard sample using the thin-film FP method. However, quantitative errors can
increase in irregular-shaped samples because the thin-film FP method assumes samples have a flat surface condition. New features with the
background FP method enable measurement of plating thickness with less error in irregular-shaped samples, such as a shaft portion of the
screw. An example of the thickness measurement of galvanized screws is shown below.

Top of Screw
(Measurement at 1 mm dia.)

Side of Screw
(Measurement at 10 mm dia. Peak Profile of Zn and Scattered X-rays

Thickness Measurement Result of Galvanizing
Measurement Position Top of Screw Side of Screw Side of Screw
Beam size 1 mm dia. 10 mm dia. 10 mm dia.
The sensitivity coefficient is Calculation Method Thin-film FP Method Thin-film FP Method Background FP Method
set by pure zinc bulk sample.
Measurement Result 4.08 m 0.96 m 4.29 m
(Results for both the side and top of the screw were obtained using the background FP method.)

EDX-7200
Energy Dispersive X-Ray Fluorescence Spectrometer 19