Xslicer SMX-6010 is a planer X-ray inspection system, featuring a micro-focus X-ray generator and a 3 megapixel flat panel detector.
It delivers high-accuracy images with a wide dynamic range that enable detailed observations of internal structures and defects.
In addition, the system switches smoothly between fluoroscopy and Computed Tomography (CT), enabling a variety of observations matched to the shape of the sample.
This supports the inspection of various samples ranging from electronic parts with improved miniaturization to mounted boards with advances in high-density multilayer design
High-Accuracy Imaging
Equipped with a 3 Megapixel Flat Panel Detector
Detailed internal structure and defects can be revealed due to the 3 megapixel flat panel detector (2.3 times larger than previously.
New HDR Processing Function
Shimadzu’s unique, proprietary image processing technique/algorithm allows fluoroscopic images with a higher dynamic range, Regions that are both easy and difficult to penetrate can be observed at the same time, which shortens inspection times.
Simple Operation
Imaging in Three Steps
Fluoroscopic imaging in just three steps.
A large monitor screen and simple button layout provide excellent visibility for intuitive operation.
X-ray inspections are easy to perform, even for operators using the system for the first time.
Switch Smoothly between Fluoroscopy and CT
Switch between fluoroscopy and CT imaging by simply clicking on the menu tab.
The Xslicer SMX-6010 features tilted CT imaging. X-ray fluoroscopic images are captured and cross-sectional images are created by tilting the flat panel detector and rotating it 360 degrees. There is no need to install a separate unit for CT imaging.
The CT imaging scan conditions are easy to configure just by selecting the scan mode, scan angle, and scan region.
A region of interest in the fluoroscopic image can be observed immediately with a CT scan.
High-Speed Imaging and High-Speed Reconstruction
The calibration procedures are completely automated to speed up the imaging process.
Cross-sectional images can be displayed in as little as two minutes after CT imaging starts.
Wide CT Imaging Range
CT images can be obtained at any position within a 350 mm x 350 mm area. There is no need to move the sample to the center of the rotary table as in conventional tilted CT, allowing the scan to be positioned just by clicking on the scanning site.
Set Tracking Points Easily
If a tracking point is set, the observation position of interest when tilted and rotated never leaves the center of the window.
As a result, the point of interest is never lost.
To set a tracking point, simply tilt the detector and double click the position of interest.
Versatile, User-Friendly Functions
Teaching Function
Fluoroscopic and CT imaging can be automated using the Teaching Function, which moves the sample stage to preregistered points of interest.
Additionally, for visual inspection, OK and NG judgment functions are included.
Stepwise Movement
The Stepwise Movement function moves the stage at constant intervals. It specifies the starting position, amount of movement, and number of movements. When this function is used, observations are performed while the stage makes consecutive movements from the starting position in accordance with the settings. Consecutive fluoroscopic or CT scans can be performed of samples arranged at set intervals.
Panoramic Imaging Function
A wide-range fluoroscopic image can be obtained just by specifying the imaging span on the external image. An improved stitching process ensures there are no visible lines in the panoramic image where the individual images are joined. A fluoroscopic image up to 32 megapixels in size can be obtained.
Image Adjustment Functions (Auto Window Function and Region of Interest Function)
The contrast can be automatically optimized to make the area of interest easy to see. Normally, with this sort of optimization function, the part outside the region of interest becomes difficult to see. However, a proprietary image processing algorithm automatically adjusts the image to ensure that the part outside the region of interest remains as easy to see as possible.
Ball Grid Array (BGA) Measurements
BGA bump diameters and void ratios can be measured.
With our proprietar y image proces sing algorithm, compl icated parameter set tings are unnecessary.*
Multiple settings can be saved and applicable ones can be accessed for each inspection target prior to measurement.
* Manual adjustments may be required depending on the sample.
Area Ratio Measurements
Die bonds, solder paste wettability, and other area ratios can be measured.
The parameter settings are not required thanks to Shimadzu’s proprietary image processing algorithm.*
It is also possible to save multiple settings, and then call up the applicable settings for each inspection target prior to measurement. Furthermore, pass/fail determinations can be made based on the area ratio.
* Manual adjustments may be required depending on the sample.
* The measurement range (ROI) can be configured manually.
Wire Sweep Ratio Measurements
The wire sweep ratio can be measured by specifying both ends of the bonding wire and the point of maximum curvature.
Pass/fail determinations can be made depending on the wire sweep ratio.
Dimension Measurements
The Xslicer SMX-6010 supports both 2-point distance and 3-point measurements.
With this system, sizes are measured efficiently by calculating calibration data internally in synchronization with the fluoroscopic magnification.
System Configuration
An easy-to-maintain
Shimadzu X-ray generator and various safety mechanisms
reduce costs and ensure safe use.
X-Ray Generator
The Xslicer SMX-6010 features a160-kV open tube and can resolve down to 1 micron.
Due to the integrated high-voltage transformer, no greasing is necessary.
The filament replacement process is simplified by automatic adjustments.
Note: 1 µm resolution by JIMA chart analysis.
X-Ray Detector
Equipped with a 3 megapixel flat panel detector.
Five-Axis Stage
In addition to the X, Y, and Z axes of the sample stage, the detector tilts and rotates.
Five-axis movement supports inspections from any angle.
X-Ray Shield Box
The X-rays are well shielded. (Maximum 1 Sv/h external X-ray leakage)
The front door lock mechanism prevents the front door from opening during X-ray emission.
The interlock mechanism also disables movement of the 5-axis stage when the door is open.
Collision Sensor
A collision sensor is provided around the X-ray detector to stop the Stage in the event of an emergency (a collision with the sample).
Utilities
System operation requires only the following: 200 V AC ± 10 %, 1.5 kVA (ground resistance 100 Ω max.) There is no need to provide air or cooling water.
Principles and Features of Planer CT Imaging
Capable of Maximum Image Enlargement for Planer Samples
■Planer CT
Scanning large circuit boards
with planer CT:
The sample is mounted on an XY stage, so it can approach the X-ray generator, enabling maximum image enlargement.
■Vertical CT
Vertical CT Viewed from above the Rotary Table
Scanning large circuit boards
with vertical CT:
When the sample is brought near the X-ray generator to increase the magnification, it will be obstructed by the X-ray generator during CT imaging, making imaging at maximum magnification impossible.
Observation Examples
For samples like circuit boards with planer CT, images with a high magnification can be obtained, unlike with orthogonal CT, which is affected by the width of the sample.
