Page 1 - Shimadzu TMA-60Series

C161-E006A

Thermomechanical Analyzer

TMA-60 Series

This instrument varies the sample temperature in accordance with a
program, and the changes in the sample dimensions are measured
while applying a constant pressure to the sample during this process.
Thermal
Glass Hardening Sublimation Thermal expansion Investigation Speci c
of
Melting transition Crystallization Polymerization Evaporation decomposition heat
Reaction Dehydration Thermal thermal
contraction history
Two Available Analyzers — Select in Accordance with the Measurement

TMA-60 Simple to use for a TMA-60H Can be used for low
Total expansion variety of measurements Differential expansion expansion measurements
With the TMA-60, three types of measurement can be performed With the TMA-60H, differential expansion measurement can be carried
tension measurement, expansion measurement, and penetration out using a reference with a known expansion coef cient, enabling
measurement. higher accuracy measurement.
The sample support tube and the detection probe can be attached and
removed with one touch, so the instrument can be used for diverse
forms of measurement, and it can be maintained with ease. Reference with a known
expansion coef cient
Tension Expansion Penetration
measurement measurement measurement
Sample

Can be attached and
removed by the
customer
●Loading modes that can be selected

Constant loading rate mode Constant extension rate mode Shrinkage stress mode
Load is varied at a constant rate Extension is varied at a constant rate Load is generated while maintaining a constant
displacement
Measurement of expansion coefficient Measurement of shrinkage stress

For More Comfortable Day-to-Day Before After
Measurement Work applying applying
TMA
TMA
um
um
●Automatic analysis using the 200.00 200.00 試料名: 試料 コメント: ANNEALED
printed circuit board
長:
10.010[mm]
加熱速度 ホールド温度ホール ド時間
[ﾟC/min ] [ ﾟC ] 175.0 [ min ] 0
5.00
"Template Function" 100.00 100.00
50.00 ﾟC 79.07 x10 /K -6 -6
70.00 ﾟC 119.88 x10 /K
Corrections, analysis, and layout setting of reports can be carried Setting 110.00 ﾟC 185.36 x10 /K -6 -6
90.00 ﾟC 150.40 x10 /K
130.00 ﾟC 187.36 x10 /K -6
out automatically using the unique "Template Function." -0.00 -0.00
150.00 ﾟC
100.00
50.00 100.00 150.00 50.00 Temp [ﾟC] 150.00
Temp [ﾟC]
This can be used not only during analysis, but also prior to
TMA
um
measurement. It will be automatically applied when measurement 200.00
試料名: printed circuit board
長:
10.010[mm]
試料 コメント: ANNEALED
is completed, and saved. 加熱速度 [ﾟC/min ] [ ﾟC ] 175.0 ホールド温度ホール [ min ] 0 ド時間
5.00
100.00
50.00 ﾟC 79.07 x10 /K -6
70.00 ﾟC 119.88 x10 /K -6
90.00 ﾟC 150.40 x10 /K -6
-6 -6
●Fusion bonding prevention mechanism -0.00 130.00 ﾟC 187.36 x10 /K Template le
110.00 ﾟC 185.36 x10 /K
150.00 ﾟC
50.00
Temp [ﾟC] 100.00 150.00
A safety mechanism is provided to prevent fusion bonding
between the measurement rod and the sample when materials
such as glass are heated. When the displacement exceeds a set
range due to melting of the sample, the analysis is immediately
stopped, and the load is removed from the sample.
With the fusion bonding prevention

mechanism there are no worries!